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30 April 2001 Fabrication of silicon sidewall profiles for fluidic applications using modified advanced silicon etching
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Proceedings Volume 4407, MEMS Design, Fabrication, Characterization, and Packaging; (2001) https://doi.org/10.1117/12.425289
Event: Microelectronic and MEMS Technologies, 2001, Edinburgh, United Kingdom
Abstract
In this work, we present a new deep etching sequence for the fabrication of circular cavities in straight silicon sidewalls. This approach allows alternating anisotropic/isotropic etches without affecting the profile generated in prior etching steps. This process sequence is crucial for realizing silicon structures that enable a variety of new applications, such as turbulence promoted liquid injector to disperse liquid effectively at the minimum injection pressure for electronic cooling, micro-evaporator or micro-combustors, surface enhancement (increase boiling nucleate sites) for micro-channel heat transfer, fluid mixing enhancer, isolation of electronic microstructures and release of mechanical microstructures.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chi-fu Wu, Lars Erdmann, Kaigham J. Gabriel, and S. C. Yao "Fabrication of silicon sidewall profiles for fluidic applications using modified advanced silicon etching", Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); https://doi.org/10.1117/12.425289
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