30 April 2001 Heterogeneous substrates for high-temperature and optical applications
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Proceedings Volume 4407, MEMS Design, Fabrication, Characterization, and Packaging; (2001) https://doi.org/10.1117/12.425327
Event: Microelectronic and MEMS Technologies, 2001, Edinburgh, United Kingdom
Further applications of MEMS require the combination of different materials in order to combine different functions in one and the same system. Besides conventional techniques (layer deposition methods) semiconductor wafer direct bonding is expected to be an effective method to produce heterogeneous materials. Different examples for optical and high-temperature applications are presented (Si-based heterostructures, Si/GaAs heterostructures).
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Manfred Reiche, Manfred Reiche, V. Dragoi, V. Dragoi, M. Alexe, M. Alexe, Ulrich M. Goesele, Ulrich M. Goesele, Erich Thallner, Erich Thallner, Ch. Schaefer, Ch. Schaefer, F. P. Lindner, F. P. Lindner, } "Heterogeneous substrates for high-temperature and optical applications", Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); doi: 10.1117/12.425327; https://doi.org/10.1117/12.425327


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