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30 April 2001Heterogeneous substrates for high-temperature and optical applications
Further applications of MEMS require the combination of different materials in order to combine different functions in one and the same system. Besides conventional techniques (layer deposition methods) semiconductor wafer direct bonding is expected to be an effective method to produce heterogeneous materials. Different examples for optical and high-temperature applications are presented (Si-based heterostructures, Si/GaAs heterostructures).
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Manfred Reiche, V. Dragoi, M. Alexe, Ulrich M. Goesele, Erich Thallner, Ch. Schaefer, F. P. Lindner, "Heterogeneous substrates for high-temperature and optical applications," Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); https://doi.org/10.1117/12.425327