Aligned substrate bonding has developed into high volume production solutions that meet the ever-increasing needs for fabrication and performance criteria. This presentation will update the audience on recent developments for high volume production of MEMS/MST.
Joe Brown, Joe Brown,
"High-volume production cost savings methods in MEMS fabrication", Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); doi: 10.1117/12.425322; https://doi.org/10.1117/12.425322