30 April 2001 High-volume production cost savings methods in MEMS fabrication
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Proceedings Volume 4407, MEMS Design, Fabrication, Characterization, and Packaging; (2001) https://doi.org/10.1117/12.425322
Event: Microelectronic and MEMS Technologies, 2001, Edinburgh, United Kingdom
Abstract
Aligned substrate bonding has developed into high volume production solutions that meet the ever-increasing needs for fabrication and performance criteria. This presentation will update the audience on recent developments for high volume production of MEMS/MST.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Joe Brown, Joe Brown, "High-volume production cost savings methods in MEMS fabrication", Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); doi: 10.1117/12.425322; https://doi.org/10.1117/12.425322
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