30 April 2001 Silicon MEM technology for millimeter-wave applications
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Proceedings Volume 4407, MEMS Design, Fabrication, Characterization, and Packaging; (2001) https://doi.org/10.1117/12.425307
Event: Microelectronic and MEMS Technologies, 2001, Edinburgh, United Kingdom
This paper presents a new silicon technology that is used for innovative components such as a MicroElectroMechanical Systems for microwave and millimeter-wave applications. This technology is based on two different bulk and surface silicon micro- machining processes. The former one, the bulk micro-machining, is well fitted to the realization of low loss microwave circuits suspended on a thin membrane, whereas the surface one allows the realization of actuable devices. This confers to the structure an interesting MEM behavior particularly important in millimeter- wave applications. As a demonstration of the advantage of combining surface and bulk micromachining a low loss (< 0.1 dB at 100 GHz), high isolation (approximately equals 30 dB at 10 GHz) capacitive switch has been designed, processed and measured. A distributed switch with enhanced performance has also been investigated.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Katia M. Grenier, Katia M. Grenier, D. Dubuc, D. Dubuc, Patrick Pons, Patrick Pons, Robert Plana, Robert Plana, L. Rabbia, L. Rabbia, T. Parra, T. Parra, Jacques Graffeuil, Jacques Graffeuil, } "Silicon MEM technology for millimeter-wave applications", Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); doi: 10.1117/12.425307; https://doi.org/10.1117/12.425307

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