DESIGN, TEST, INTEGRATION, AND PACKAGING OF MEMS/MOEMS 2001
25-27 April 2001
Cannes-Mandelieu, France
Joint Invited Papers
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 1 (5 April 2001); doi: 10.1117/12.425336
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 2 (5 April 2001); doi: 10.1117/12.425346
Design of MEMS Components
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 40 (5 April 2001); doi: 10.1117/12.425357
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 50 (5 April 2001); doi: 10.1117/12.425366
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 59 (5 April 2001); doi: 10.1117/12.425376
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 63 (5 April 2001); doi: 10.1117/12.425386
Manufacturing of Components for Communication Applications I
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 283 (5 April 2001); doi: 10.1117/12.425397
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 289 (5 April 2001); doi: 10.1117/12.425399
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 301 (5 April 2001); doi: 10.1117/12.425400
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 310 (5 April 2001); doi: 10.1117/12.425337
Design and Characterization of MEMS Components
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 73 (5 April 2001); doi: 10.1117/12.425338
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 81 (5 April 2001); doi: 10.1117/12.425339
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 86 (5 April 2001); doi: 10.1117/12.425340
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 96 (5 April 2001); doi: 10.1117/12.425341
Integrated Process and Manufacturing
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 317 (5 April 2001); doi: 10.1117/12.425342
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 329 (5 April 2001); doi: 10.1117/12.425343
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 338 (5 April 2001); doi: 10.1117/12.425344
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 344 (5 April 2001); doi: 10.1117/12.425345
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 360 (5 April 2001); doi: 10.1117/12.425347
Joint Invited Papers
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 6 (5 April 2001); doi: 10.1117/12.425348
Methods and Tools for the Design of MOEMS
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 104 (5 April 2001); doi: 10.1117/12.425349
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 116 (5 April 2001); doi: 10.1117/12.425350
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 126 (5 April 2001); doi: 10.1117/12.425351
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 138 (5 April 2001); doi: 10.1117/12.425352
Characterization and Reliability
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 368 (5 April 2001); doi: 10.1117/12.425353
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 381 (5 April 2001); doi: 10.1117/12.425354
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 391 (5 April 2001); doi: 10.1117/12.425355
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 402 (5 April 2001); doi: 10.1117/12.425356
Testing and Failure Analysis
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 147 (5 April 2001); doi: 10.1117/12.425358
Packaging and Assembly
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 409 (5 April 2001); doi: 10.1117/12.425359
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 415 (5 April 2001); doi: 10.1117/12.425360
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 424 (5 April 2001); doi: 10.1117/12.425361
Joint Invited Papers
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 19 (5 April 2001); doi: 10.1117/12.425362
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 28 (5 April 2001); doi: 10.1117/12.425363
Design Flows
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 159 (5 April 2001); doi: 10.1117/12.425364
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 165 (5 April 2001); doi: 10.1117/12.425365
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 175 (5 April 2001); doi: 10.1117/12.425367
Manufacturing of Components for Communication Applications II
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 430 (5 April 2001); doi: 10.1117/12.425368
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 438 (5 April 2001); doi: 10.1117/12.425369
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 445 (5 April 2001); doi: 10.1117/12.425370
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 452 (5 April 2001); doi: 10.1117/12.425371
Joint Invited Papers
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 29 (5 April 2001); doi: 10.1117/12.425372
Analysis Tools and Methods
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 194 (5 April 2001); doi: 10.1117/12.425373
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 201 (5 April 2001); doi: 10.1117/12.425374
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 209 (5 April 2001); doi: 10.1117/12.425375
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 216 (5 April 2001); doi: 10.1117/12.425377
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 226 (5 April 2001); doi: 10.1117/12.425378
Devices and Components
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 463 (5 April 2001); doi: 10.1117/12.425379
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 469 (5 April 2001); doi: 10.1117/12.425380
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 478 (5 April 2001); doi: 10.1117/12.425381
Poster Papers: CAD, Design and Test
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 237 (5 April 2001); doi: 10.1117/12.425382
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 246 (5 April 2001); doi: 10.1117/12.425383
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 254 (5 April 2001); doi: 10.1117/12.425384
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 263 (5 April 2001); doi: 10.1117/12.425385
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 272 (5 April 2001); doi: 10.1117/12.425387
Design Flows
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 187 (5 April 2001); doi: 10.1117/12.425388
Posters on Microfabrication, Integration and Packaging
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 486 (5 April 2001); doi: 10.1117/12.425389
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 494 (5 April 2001); doi: 10.1117/12.425390
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 502 (5 April 2001); doi: 10.1117/12.425391
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 510 (5 April 2001); doi: 10.1117/12.425392
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 522 (5 April 2001); doi: 10.1117/12.425393
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 528 (5 April 2001); doi: 10.1117/12.425394
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 535 (5 April 2001); doi: 10.1117/12.425395
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 543 (5 April 2001); doi: 10.1117/12.425396
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, pg 548 (5 April 2001); doi: 10.1117/12.425398
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