5 April 2001 Compact dynamic thermal multiport models of packages for MEMS-package cosimulation
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Proceedings Volume 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001; (2001) https://doi.org/10.1117/12.425360
Event: Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, 2001, Cannes-Mandelieu, France
Abstract
Co-simulation of MEMS and their packages is indispensable if the thermal behavior of the MEMS device is critical. For the co-simulation we need a reduced order thermal model of the package in the form of either behavioral or network model form. The paper presents a method for the automated generation of dynamic thermal multi-port models of packages, based on simulation results. The method is general, in will be applicable also for the direct generation of package multi- port network models of thermal transient testers.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Marta Rencz, Marta Rencz, Vladimir Szekely, Vladimir Szekely, } "Compact dynamic thermal multiport models of packages for MEMS-package cosimulation", Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); doi: 10.1117/12.425360; https://doi.org/10.1117/12.425360
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