5 April 2001 Finite element analysis to support component level fault modeling for MEMS
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Proceedings Volume 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001; (2001) https://doi.org/10.1117/12.425358
Event: Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, 2001, Cannes-Mandelieu, France
Abstract
Component level (nodal) simulations have been proposed to both implement closed loop simulation of complete microsystems to support the migration to shorter design cycles and implement fault models of micro-mechanical components. Within such a simulation environment, library cells in the form of behavioral models, are used for the basic components of microelectromechanical (MEM) transducers, such as beams, plates, comb-drives and membranes. This paper presents both a methodology to generate the model parameters required for the implementation of accurate component level fault models and simulation results from a number of representative defective structures in a MEMS product.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
R. Reichenbach, R. Reichenbach, Richard Rosing, Richard Rosing, Andrew Richardson, Andrew Richardson, A. Dorey, A. Dorey, } "Finite element analysis to support component level fault modeling for MEMS", Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); doi: 10.1117/12.425358; https://doi.org/10.1117/12.425358
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