5 April 2001 Flat micro heat pipe arrays for cooling and thermal management at the package level
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Proceedings Volume 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001; (2001) https://doi.org/10.1117/12.425361
Event: Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, 2001, Cannes-Mandelieu, France
Abstract
An experimental investigation was performed to study the heat transfer of flat micro heat pipe (FMHP) arrays with 38 triangular microgrooves. A heat pipe is an effective heat transport device that uses the latent heat of vaporization and operates without external power and achieves very high thermal conductance by means of two-phase fluid flow with capillary circulation. The overall size of the FMHP is 24 mm X 16 mm X 1.25 mm. The FMHP that can be put underneath microelectronic die and integrated into the electronic package of microelectronic device has been fabricated and characterized. Water was used as a working liquid. The fabrication and heat transfer details along with steady state horizontal orientation performance test results are presented. The experimental results show the temperature decrease of 12.1 degrees Celsius at the evaporator section for the input power of 5.9 W and the improvement of 28% in effective thermal conductivity.
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J. S. Park, J. S. Park, J. H. Choi, J. H. Choi, H. C. Cho, H. C. Cho, Sang Sik Yang, Sang Sik Yang, J. S. Yoo, J. S. Yoo, } "Flat micro heat pipe arrays for cooling and thermal management at the package level", Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); doi: 10.1117/12.425361; https://doi.org/10.1117/12.425361
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