5 April 2001 Low-cost MOEM interconnect modules for Tb/s.cm2 aggregate bandwidth to silicon chips
Author Affiliations +
Proceedings Volume 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001; (2001) https://doi.org/10.1117/12.425348
Event: Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, 2001, Cannes-Mandelieu, France
Abstract
We report on the design, the fabrication, the characterization and the demonstration of scalable multi-channel free-space interconnection components with the potential for Tb/s.cm2 aggregate bit rate capacity over inter-chip interconnection distances. The demonstrator components are fabricated in a high quality optical plastic, PMMA, using an ion-based rapid prototyping technology that we call deep proton lithography. With the presently achieved Gigabit/s data rates for each of the individual 16 channels with a BER smaller than 10-13 and with inter-channel cross-talk lower than -22dB the module aims at optically interconnecting 2-D opto-electronic VCSEL and receiver arrays, flip-chip mounted on CMOS circuitry. Furthermore, using ray-tracing software and radiometric simulation tools, we perform a sensitivity analysis for misalignment and fabrication errors on these plastic micro-optical modules and we study industrial fabrication and material issues related to the mass- replication of these components through injection-molding techniques. Finally we provide evidence that these components can be mass-fabricated in dedicated, highly-advanced optical plastics at low cost and with the required precision.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hugo Thienpont, Valerie Baukens, Bart Volckaerts, Heidi Ottevaere, Christof Debaes, Michael Vervaeke, Patrik Tuteleers, Pedro Vynck, Alex Hermanne, Mike Hanney, Marnik Brunfaut, Jan M. Van Campenhout, Irina P. Veretennicoff, "Low-cost MOEM interconnect modules for Tb/s.cm2 aggregate bandwidth to silicon chips", Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); doi: 10.1117/12.425348; https://doi.org/10.1117/12.425348
PROCEEDINGS
13 PAGES


SHARE
Back to Top