5 April 2001 Modular concept for the design of application-specific integrated telemetric systems
Author Affiliations +
Proceedings Volume 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001; (2001) https://doi.org/10.1117/12.425383
Event: Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, 2001, Cannes-Mandelieu, France
Abstract
Modern microsystem technology generates a great variety of very small sensors and actuators. With the use of capacitive measurement or moving principles these components have a very low power consumption and with some data preprocessing they can be used in passive telemetry systems, which need no integrated battery. Instead, they use two loosely coupled coils to realize the energy transfer. To create very small systems, e.g. for the implantation inside the human body, the use of an application specific integrated circuit for the telemetry will be necessary. In this paper a design strategy for the realization of implantable telemetric microsystems and a building set with different blocks for the creation of an application specific telemetry chip is presented. In addition to the necessary main building blocks like rectifiers, voltage regualtors and blocks for the uni- or bi-directional data transmission the set also includes some supplementary blocks like an auaotmatic resonance adjust. All blocks are realized in a standard CMOS process (a 0.7 um CMOS process with some analogue add-ons) and therfore very small and cheap systems can be created.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Claudia Marschner, Sven Rehfuss, Dagmar Peters, Hilmar Bolte, Rainer Laur, "Modular concept for the design of application-specific integrated telemetric systems", Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); doi: 10.1117/12.425383; https://doi.org/10.1117/12.425383
PROCEEDINGS
8 PAGES


SHARE
Back to Top