Reliability of self-assembled 3D microstructures: snap-through modeling and experimental validation

Olivier Millet; Lionel Buchaillot; Emmanuel Quevy; Dominique Collard

doi:10.1117/12.425355

5 April 2001 Reliability of self-assembled 3D microstructures: snap-through modeling and experimental validation

Olivier Millet, Lionel Buchaillot, Emmanuel Quevy, Dominique Collard

Proceedings Volume 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001; (2001) https://doi.org/10.1117/12.425355
Event: Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, 2001, Cannes-Mandelieu, France

Abstract

This work considers the reliability of an elementary 3D structure, and particularly the response of a homogeneous, clamped-clamped polysilicon microfabricated beam, buckling under the compressive force produced by Scratch-Drive Actuators (SDA). First, using Galerkin's method, the governing partial differential equation reduced to a modified Duffing equation and was solved by the harmonic balance method. Besides the solution of simple harmonic motion (SHM) and superharmonic motion (SPHM) were found numerically using a Newton iteration method. Then, the study of continuity -- of these solutions -- allowed to analyze the stability boundaries. Finally, Runge-Kutta numerical integration method was used to investigate the snap-through problem. Intermittent, as well as continuous, snap-through behavior was obtained. The theoretical results agreed well with the experiments.

Citation Download Citation

Olivier Millet, Lionel Buchaillot, Emmanuel Quevy, and Dominique Collard "Reliability of self-assembled 3D microstructures: snap-through modeling and experimental validation", Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); https://doi.org/10.1117/12.425355

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