5 April 2001 Thermal-induced stress in dielectric membranes suitable for micromechanized gas sensors
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Proceedings Volume 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001; (2001); doi: 10.1117/12.425339
Event: Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, 2001, Cannes-Mandelieu, France
Abstract
A laboratory model of a gas sensor substrate produced in microelectronic technology has been experimentally analyzed and simulated by means of a 3D FEM model. This paper discusses its thermal and mechanical behavior under different working temperatures. The thermal expansion mismatch between different materials induces thermal stresses and structure deflection. Simulated and experimental results are proved to be in good agreement. Moreover, the proposed design offers low-power consumption, good thermal uniformity, low thermal inertia and mechanical stability up to 650 degrees Celsius.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. Puigcorbe, A. Vila, Isabel Gracia, Carles Cane, Juan Ramon Morante, "Thermal-induced stress in dielectric membranes suitable for micromechanized gas sensors", Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); doi: 10.1117/12.425339; https://doi.org/10.1117/12.425339
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KEYWORDS
Gas sensors

Temperature metrology

Dielectrics

Finite element methods

3D modeling

Sensors

Convection

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