5 April 2001 Ultrahigh capacity MEMS-based optical cross-connects
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Proceedings Volume 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001; (2001) https://doi.org/10.1117/12.425346
Event: Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, 2001, Cannes-Mandelieu, France
Abstract
Backbone optical systems with ever-increasing transport capacity and routing complexity are driving the need for large port count core switches that can intelligently scale to manage the amounting bandwidth mass. Optical switching fabrics and in particular those based on MEMS technology potentially offer a scalable solution for the cross-connect network element. However the road from this exciting research endeavor to creating a reliable and manufacturable product is filled with challenges. The design, integration, and assembly of optical switch fabrics with over 1000 working ports stress all aspects of product development from component fabrication to mechanical tolerances and thermal manageability. In this paper we describe the myriad of contending optical, mechanical, and electronic design tradeoffs that contribute to the development of a 3D-MEMS based optical cross-connect.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Keren Bergman, Keren Bergman, Nicolas H. Bonadeo, Nicolas H. Bonadeo, Igal Brener, Igal Brener, Kophu P. Chiang, Kophu P. Chiang, } "Ultrahigh capacity MEMS-based optical cross-connects", Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); doi: 10.1117/12.425346; https://doi.org/10.1117/12.425346
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