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5 September 2001 Defect dispositioning using mask printability on attenuated phase-shift production photomasks
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Proceedings Volume 4409, Photomask and Next-Generation Lithography Mask Technology VIII; (2001) https://doi.org/10.1117/12.438407
Event: Photomask and Next Generation Lithography Mask Technology VIII, 2001, Kanagawa, Japan
Abstract
Recently a new mask qualification concept is getting more and more attention. Mask makers are challenged to meet mask and defect specifications of 130 and 100-nm technology node. This means very tight specifications, which usually lead to long mask delivery times. A main factor in the mask making process is mask inspection and repair. The mask repair cycle is not only time-consuming, but also bears the danger of damaging a mask. At the same time, when investigating defect printability, it is getting clear that a lot of today detected defects do not affect wafer-printing results at all. The concept Inspect all - Repair only what prints is introduced. In this paper a study comparing different defect classification methods and their impact on mask repair cycle time is presented.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Justin W. Novak, Benjamin George Eynon Jr., Anja Rosenbusch, and Alex Goldenshtein "Defect dispositioning using mask printability on attenuated phase-shift production photomasks", Proc. SPIE 4409, Photomask and Next-Generation Lithography Mask Technology VIII, (5 September 2001); https://doi.org/10.1117/12.438407
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