25 September 2001 Misalignment-tolerant packaging of optical-interconnection-based systems using multiple photodetectors
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Proceedings Volume 4417, Photonics 2000: International Conference on Fiber Optics and Photonics; (2001) https://doi.org/10.1117/12.441294
Event: Photonics 2000: International Conference on Fiber Optics and Photonics, 2001, Calcutta, India
Abstract
Alignment tolerance can be improved if instead of a large photodetector an array of several photodetectors is used to receive the power in each light beam used for interconnection. The design formulae for optically selecting the number of photodetectors, the center-to-center spacing between the photodetectors, and the radii of the photodetectors in a focal plane array are derived as a function of the spot sizes and diffraction patterns of the beams. Since photocurrents generated by several smaller photodiodes are summed together it is possible to enhance the signal to noise ratio without suffering a degradation in the overall bandwidth in the interconnect.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Anjan K. Ghosh, Anjan K. Ghosh, "Misalignment-tolerant packaging of optical-interconnection-based systems using multiple photodetectors", Proc. SPIE 4417, Photonics 2000: International Conference on Fiber Optics and Photonics, (25 September 2001); doi: 10.1117/12.441294; https://doi.org/10.1117/12.441294
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