Paper
26 June 2001 New mechanism of laser dry cleaning
Author Affiliations +
Proceedings Volume 4423, Nonresonant Laser-Matter Interaction (NLMI-10); (2001) https://doi.org/10.1117/12.431213
Event: Nonresonant Laser-Matter Interaction (NLMI-10), 2000, St. Petersburg, Russian Federation
Abstract
The dry laser cleaning arises due to thermal expansion of the substrate and/or particle, when the corresponding acceleration force produces work sufficient to overcome the adhesion energy. The previous examinations of the dry cleaning were done for two mechanisms: 1) expansion of absorbing particle on the transparent substrate and 2) expansion of the absorbing substrate with non-absorbing particle. Nevertheless using model with conventional mechanism based on the 1D surface expansion, one can find threshold fluence by the order of magnitude higher than experimental one. In the present paper, we discuss the new mechanism for situation when the particle is heated due to thermal contact with substrate, and additional thermo deformation effect, caused by optical enhancement. It is shown that these effects can be responsible for relatively small threshold fluence for laser cleaning of SiO2 particles from the surface of Si by ns-excimer laser pulse.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Boris S. Luk'yanchuk, Yuan Wei Zheng, and Yongfeng Lu "New mechanism of laser dry cleaning", Proc. SPIE 4423, Nonresonant Laser-Matter Interaction (NLMI-10), (26 June 2001); https://doi.org/10.1117/12.431213
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Cited by 10 scholarly publications.
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KEYWORDS
Particles

Pulsed laser operation

Near field

Silicon

Laser damage threshold

Near field optics

3D modeling

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