25 February 2002 Development of laser turning using femtosecond laser ablation
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Proceedings Volume 4426, Second International Symposium on Laser Precision Microfabrication; (2002) https://doi.org/10.1117/12.456877
Event: Second International Symposium on Laser Precision Micromachining, 2001, Singapore, Singapore
Abstract
Ablation using femtosecond-lasers has taken much attention for micromachining with the advantages of efficient ultra-thin layer peeling without undesirable thermal effects for both opaque and transparent materials. In this work, we have proposed the femtosecond-laser turning based on the fact that femtosecond-laser ablation is a promising technique for excellent surface finishing techniques. The effect of the machining conditions such as focusing condition, energy of laser pulse and plural scanning, on the thickness of peeling layer for various kinds of materials (PMMA, silica glass, silicon, copper and aluminum) have been investigated. As a result, the important information for the laser turning as a practical application of the femtosecond lasers were obtained.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Atsushi Yokotani, Kosuke Kawahara, Yasunobu Kurogi, Naoyuki Matsuo, Hiroshi Sawada, Kou Kurosawa, "Development of laser turning using femtosecond laser ablation", Proc. SPIE 4426, Second International Symposium on Laser Precision Microfabrication, (25 February 2002); doi: 10.1117/12.456877; https://doi.org/10.1117/12.456877
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