25 February 2002 Hole drilling of glass-foam substrates with laser
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Proceedings Volume 4426, Second International Symposium on Laser Precision Microfabrication; (2002) https://doi.org/10.1117/12.456803
Event: Second International Symposium on Laser Precision Micromachining, 2001, Singapore, Singapore
Abstract
Using 10 - 100 msec pulses and a 10.6 micrometers wavelength CO2 laser, focused to a spot size 200 micrometers , we have produced holes into glass-foam substrates. We examine the effect of pulse width on the hole structure and the pile-up around the hole in single-pulse drilling. The height of the pile-up increases 7 - 30 micrometers with increasing the pulse width. The residual melting layer is under 0.5 (mu) m in the hole walls. It seems that the glass-foam substrate is suitable for laser beam machining.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yoshikazu Yoshida, Hiroyoshi Yajima, Yuji Hashidate, Hiroshi Ogura, Shuhei Ueda, "Hole drilling of glass-foam substrates with laser", Proc. SPIE 4426, Second International Symposium on Laser Precision Microfabrication, (25 February 2002); doi: 10.1117/12.456803; https://doi.org/10.1117/12.456803
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