25 February 2002 Hole drilling of glass-foam substrates with laser
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Proceedings Volume 4426, Second International Symposium on Laser Precision Microfabrication; (2002) https://doi.org/10.1117/12.456803
Event: Second International Symposium on Laser Precision Micromachining, 2001, Singapore, Singapore
Abstract
Using 10 - 100 msec pulses and a 10.6 micrometers wavelength CO2 laser, focused to a spot size 200 micrometers , we have produced holes into glass-foam substrates. We examine the effect of pulse width on the hole structure and the pile-up around the hole in single-pulse drilling. The height of the pile-up increases 7 - 30 micrometers with increasing the pulse width. The residual melting layer is under 0.5 (mu) m in the hole walls. It seems that the glass-foam substrate is suitable for laser beam machining.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yoshikazu Yoshida, Yoshikazu Yoshida, Hiroyoshi Yajima, Hiroyoshi Yajima, Yuji Hashidate, Yuji Hashidate, Hiroshi Ogura, Hiroshi Ogura, Shuhei Ueda, Shuhei Ueda, } "Hole drilling of glass-foam substrates with laser", Proc. SPIE 4426, Second International Symposium on Laser Precision Microfabrication, (25 February 2002); doi: 10.1117/12.456803; https://doi.org/10.1117/12.456803
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