25 February 2002 Laser reflow plastic ball grid array
Author Affiliations +
Proceedings Volume 4426, Second International Symposium on Laser Precision Microfabrication; (2002) https://doi.org/10.1117/12.456834
Event: Second International Symposium on Laser Precision Micromachining, 2001, Singapore, Singapore
Abstract
A modified fast-modulated CW Nd:YAG is used to reflow plastic ball grid array (PBGA). Sn-Pb eutectic solder balls with a diameter of 760 micrometers and Au-Ni-Cu solder pads are used in the study. Shear strength tests are preformed to find out the optimal reflow parameters. An energy equilibrium model is proposed to estimate the average temperatures of solder joint under the given experimental conditions. Based on the experimental and theoretical results, a parameter range for laser reflow of the 760 micrometers Sn-Pb eutectic solder balls is proposed.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
DaMing Liu, DaMing Liu, Tao Chen, Tao Chen, Yuan Yuan, Yuan Yuan, Yongfeng Lu, Yongfeng Lu, Minghui Hong, Minghui Hong, Ryan J. K. Goh, Ryan J. K. Goh, } "Laser reflow plastic ball grid array", Proc. SPIE 4426, Second International Symposium on Laser Precision Microfabrication, (25 February 2002); doi: 10.1117/12.456834; https://doi.org/10.1117/12.456834
PROCEEDINGS
4 PAGES


SHARE
Back to Top