25 February 2002 Laser singulation of IC packages
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Proceedings Volume 4426, Second International Symposium on Laser Precision Microfabrication; (2002) https://doi.org/10.1117/12.456850
Event: Second International Symposium on Laser Precision Micromachining, 2001, Singapore, Singapore
Abstract
The separation of IC packages from a BGA board is realized by means of laser multi-scan method. The laser used in the study is a double frequency Nd-YAG laser with wavelength of 532 nm. The big problem in the laser processing approach mainly arises from the multi-layer materials of BGA board with copper, polyethylene and epoxy glass fiber, because of their different absorption coefficient to the laser beam and their different absorption coefficient to the laser beam and their different heat conductivity. In the experiment approach, the effects of laser parameters, such as wavelength, on the dicing efficiency has been investigated for choosing laser. The influence of sample side for laser incidence on cut profile and, the influence of the focused extent of laser beam on singulation speed are discussed. The experimental results show that laser singulation of IC packages is efficient and reliable.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chengwu An, Chengwu An, Kaidong D. Ye, Kaidong D. Ye, Yuan Yuan, Yuan Yuan, Minghui Hong, Minghui Hong, Yongfeng Lu, Yongfeng Lu, } "Laser singulation of IC packages", Proc. SPIE 4426, Second International Symposium on Laser Precision Microfabrication, (25 February 2002); doi: 10.1117/12.456850; https://doi.org/10.1117/12.456850
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