25 February 2002 Precision machining of innovative materials using 157-nm excimer laser radiation
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Proceedings Volume 4426, Second International Symposium on Laser Precision Microfabrication; (2002) https://doi.org/10.1117/12.456905
Event: Second International Symposium on Laser Precision Micromachining, 2001, Singapore, Singapore
Abstract
The F2 excimer laser emitting at 157 nm have been developed to reliable industrial machines applicable for micro-fabrication. Fluorine lasers are available at various power ratings, with energies between 1 mJ and more than 50 mJ and repetition rates up to 2 kHz. The applications of the F2 lasers presented here are mainly related to the micro-machining of glasses, with a special focus on fused silica. Depending on the applied fluence, fused silica can be processed with 157 nm by material ablation as well as by modifying the optical properties, when the energy density is beyond the ablation threshold. Both techniques qualify the 157 nm for manufacturing optical elements like planar wave guides or grating structures. Furthermore, the wavelength has been tested for micro-fluidic and micro-mechanical structures.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Andreas Ostendorf, Andreas Ostendorf, Uwe Stamm, Uwe Stamm, Thorsten Temme, Thorsten Temme, } "Precision machining of innovative materials using 157-nm excimer laser radiation", Proc. SPIE 4426, Second International Symposium on Laser Precision Microfabrication, (25 February 2002); doi: 10.1117/12.456905; https://doi.org/10.1117/12.456905
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