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13 November 2001 Wafer-scale manufacturing and integration of micro-optical systems
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Demand for optical components and subsystems has exploded in the last decade. The question directed at component providers by customers is no longer when can you make it? The critical question is now become when can you make it in high volume? Wafer scale manufacturing, developed for the integrated circuit industry, has transitioned into the realm of optical fabrication and assembly. Photonic Chip optical subassemblies are products fabricated using these techniques. To create them, the optical elements are lithographically generated with integrated alignment and bonding features. Wafers of complimentary elements can be aligned and bonded at the wafer level, assembling hundreds of optical systems in parallel with a single operation. Electro-optical components, such as source and detector elements can be assembled into the system at the chip level, using flip-chip die bonding to complete the mechanical and electrical connection. The striking features of this manufacturing method are its parallel assembly techniques, broad use of automation, and very attractive intrinsic cost at high volume.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alan D. Kathman and Mark Boomgarden "Wafer-scale manufacturing and integration of micro-optical systems", Proc. SPIE 4437, Gradient Index, Miniature, and Diffractive Optical Systems II, (13 November 2001);


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