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5 November 2001 Advances in light curing adhesives
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Abstract
This paper describes the development of a new family of light curing adhesives containing a new reactive additive previously not used in optical grade light curing adhesives are obtained with the addition of functionalized cellulositics. Outgassing as low as 10-6 grams/gram has been observed based on headspace sampling. Other additives have lowered the shrinkage rates of positioning adhesives from near 1 percent to less than 0.1 percent with fractional, percentage movements over thermal range of -40 degrees C to +200 degrees C.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Andy Bachmann "Advances in light curing adhesives", Proc. SPIE 4444, Optomechanical Design and Engineering 2001, (5 November 2001); https://doi.org/10.1117/12.447301
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