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5 November 2001 Structural and thermal modeling of a cooled CCD camera
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This paper presents structural and thermal modeling of a high-performance CCD camera designed to operate under severe environments. Minimizing the dark current noise required the CCD to be maintained at low temperature while the camera operated in a 70 degrees C environment. A thermoelectric cooler (TEC) was selected due to its simplicity, and relatively low cost. Minimizing the thermal parasitic loads due to conduction and convection, and maximizing the heat sink performance was critical in this design. The critical structural features of this camera are the CCD leads and the bond joint that holds the CCD in alignment relative to the lens. The CCD leads are susceptible to fatigue failure when subjected to random vibrations for an extended period of time. This paper outlines the methods used to model and analyze the CCD leads for fatigue, the supportive vibration testing performed and the steps taken to correct for structural inadequacies found in the original design. The key results of all this thermal and structural modeling and testing are presented.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Anees Ahmad, Thomas D. Arndt, Robert Gross, Mark Hahn, and Mark Panasiti "Structural and thermal modeling of a cooled CCD camera", Proc. SPIE 4444, Optomechanical Design and Engineering 2001, (5 November 2001);


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