10 December 2001 Rapid Confocal Sensor: a noncontact profilometer for fast 3D submicron inspection and metrology of large formats
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Abstract
The Rapid Confocal Sensor delivers sub-micron depth and five-micron lateral resolutions over a 300-mm format. With some a priori knowledge of a sample, an analysis over the 300-mm field is completed in approximately 7 minutes. An overview of the optical system (sensor) is given. Application of this technology is made to rapid 3D process inspection of semiconductor samples, particularly die contact bumps. Results demonstrating performance from a commercially available system are presented.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David Vaughnn, David Vaughnn, Cory Watkins, Cory Watkins, Dick Anderson, Dick Anderson, } "Rapid Confocal Sensor: a noncontact profilometer for fast 3D submicron inspection and metrology of large formats", Proc. SPIE 4449, Optical Metrology Roadmap for the Semiconductor, Optical, and Data Storage Industries II, (10 December 2001); doi: 10.1117/12.450092; https://doi.org/10.1117/12.450092
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