Paper
29 May 2002 Analysis of experiments on mechanical properties of thin films
Yilan Kang, Donghui Fu, Huaiwen Wang, Zhixing Lu
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Proceedings Volume 4537, Third International Conference on Experimental Mechanics; (2002) https://doi.org/10.1117/12.468845
Event: Third International Conference on Experimental Mechanics, 2002, Beijing, China
Abstract
The intelligent and information industries are rapidly developing and will have larger and larger shares in the GNP. Most components of these high-tech industries are made of small-scale low-dimensional materials, such as thin films, filaments and microstructure. As the thin film is one of the basic constructional elements, the scientific research in the thin film materials, especially for mechanical behavior research, attracts special attention. The mechanical properties of the materials that have microscale in the direction of thickness may be different form those of the microscale materials, but it is a valuable facto of working reliability for microstructure. So the experimental study on the mechanical properties, especially some of the basic nonlinear mechanical properties, is necessary and significant in constructing mechanical model, optimizing design, analyzing the quality and reliability of the components.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yilan Kang, Donghui Fu, Huaiwen Wang, and Zhixing Lu "Analysis of experiments on mechanical properties of thin films", Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); https://doi.org/10.1117/12.468845
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KEYWORDS
Thin films

Humidity

Adhesives

Reliability

Speckle

Copper

CCD cameras

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