Application of noncontact deformation measurement in mechanical properties study of MEMS

Xin Kang; Xiaoyuan He; Lin Liu

doi:10.1117/12.468759

29 May 2002 Application of noncontact deformation measurement in mechanical properties study of MEMS

Xin Kang, Xiaoyuan He, Lin Liu

Proceedings Volume 4537, Third International Conference on Experimental Mechanics; (2002) https://doi.org/10.1117/12.468759
Event: Third International Conference on Experimental Mechanics, 2002, Beijing, China

Abstract

The reliability and lifetime of microelectromechanical systems (MEMS) are strongly depending on the material properties. It is important to develop methods for the measurement of MEMS material properties. In this paper an optical technique for measuring tensile strain of micro-specimen is proposed. The technique, which is based on digital speckle correlation method works by determining the deformation of specimen between two neighboring loading step by step. The problem of non-correlation is solved when the deformation is too large. The experimental results of a copper wire are given in this paper. The proposed technique is also applicable for measuring other MEMS materials that may be even smaller or thinner than that used in this paper.

Citation Download Citation

Xin Kang, Xiaoyuan He, and Lin Liu "Application of noncontact deformation measurement in mechanical properties study of MEMS", Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); https://doi.org/10.1117/12.468759

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