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29 May 2002 Application of noncontact deformation measurement in mechanical properties study of MEMS
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Proceedings Volume 4537, Third International Conference on Experimental Mechanics; (2002) https://doi.org/10.1117/12.468759
Event: Third International Conference on Experimental Mechanics, 2002, Beijing, China
Abstract
The reliability and lifetime of microelectromechanical systems (MEMS) are strongly depending on the material properties. It is important to develop methods for the measurement of MEMS material properties. In this paper an optical technique for measuring tensile strain of micro-specimen is proposed. The technique, which is based on digital speckle correlation method works by determining the deformation of specimen between two neighboring loading step by step. The problem of non-correlation is solved when the deformation is too large. The experimental results of a copper wire are given in this paper. The proposed technique is also applicable for measuring other MEMS materials that may be even smaller or thinner than that used in this paper.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xin Kang, Xiaoyuan He, and Lin Liu "Application of noncontact deformation measurement in mechanical properties study of MEMS", Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); https://doi.org/10.1117/12.468759
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