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29 May 2002 Experimental methods and tools in electronic packaging applications
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Proceedings Volume 4537, Third International Conference on Experimental Mechanics; (2002) https://doi.org/10.1117/12.468801
Event: Third International Conference on Experimental Mechanics, 2002, Beijing, China
Abstract
Experimental characterization plays a significant role in the reliability analysis of electronic packaging and, therefore, is critical in package design and manufacturing. Experimental characterization deals with the material, process and design issues in electronic packaging to ensure processability and reliability. The reliability of a package should be sufficient to meet the manufacture process requirements and the product life expectancy under application conditions. As electronic technology advances, more novel materials are being used in packages and package sizes are becoming smaller and smaller. The components are typically structures with multi-materials and interfaces in a highly compact and integrated feature. The manufacturing process for the semiconductor devices and the related packages are becoming more and more sophisticated, involving numerous complicated steps. As a result, the process characterizations and reliability analysis are becoming more and more challenging. Together with many analytical and numerical methods used in this area, experimental methods have become more and more important. The experimental methods provide material properties which are needed in the theoretical and numerical modeling and for material selections. They are also critical in the areas of processes characterizations and failure analysis for design optimizations.
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Yifan Guo and Tuo Li "Experimental methods and tools in electronic packaging applications", Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); https://doi.org/10.1117/12.468801
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