Microregion stress measurement of wafer

Shouyong Ni; Hongmin Shi; Lei Fu; Yaodong Lu

doi:10.1117/12.468854

29 May 2002 Microregion stress measurement of wafer

Shouyong Ni, Hongmin Shi, Lei Fu, Yaodong Lu

Proceedings Volume 4537, Third International Conference on Experimental Mechanics; (2002) https://doi.org/10.1117/12.468854
Event: Third International Conference on Experimental Mechanics, 2002, Beijing, China

Abstract

A method based on birefringence principle of micro-region stress measurement is presented in this article. Frequency analysis of Fourier transform is used in data processing. This measurement system has the merits of high sensitivity and automatic data processing.

Citation Download Citation

Shouyong Ni, Hongmin Shi, Lei Fu, and Yaodong Lu "Microregion stress measurement of wafer", Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); https://doi.org/10.1117/12.468854

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