28 September 2001 Comparative analysis of silicon wafers micromachining versus nonconventional technology
Author Affiliations +
Proceedings Volume 4557, Micromachining and Microfabrication Process Technology VII; (2001) https://doi.org/10.1117/12.442957
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States
Abstract
In very large scale of integration (VLSI) processing photolithographic techniques control the patterning of thin film and the deposition of dopant used to make transistor gates and metal contacts. Microelectromechanical systems (MEMS) processing uses the same techniques to create structural components that are essentially submillimeter-sized machines parts. These parts usually require post-fabrication processing or assembly in order to become finished devices. MEMS technology can generally be categorized into two groups as bulk and surface micromachining. These categories respect not only different fabrication processes but different post fabrication techniques for finishing the mechanical subsystem.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dumitru Gh. Ulieru, Dumitru Gh. Ulieru, } "Comparative analysis of silicon wafers micromachining versus nonconventional technology", Proc. SPIE 4557, Micromachining and Microfabrication Process Technology VII, (28 September 2001); doi: 10.1117/12.442957; https://doi.org/10.1117/12.442957
PROCEEDINGS
7 PAGES


SHARE
Back to Top