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28 September 2001 Micromachining of packaging materials for MEMS using lasers
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Proceedings Volume 4557, Micromachining and Microfabrication Process Technology VII; (2001) https://doi.org/10.1117/12.442948
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States
Abstract
New lithographic, deposition, and etching tools for micro fabrication on planar silicon substrates have led to remarkable advances in miniaturization of silicon devices. However silicon is often not the substrate material of choice for applications in which there are requirements for electrically or thermally insulating substrates, low capacitance, resistance to corrosion, or hermetic sealing. Some of the MEMS packaging materials such as ceramics, polymers, and glass are currently being used to fabricate many microdevices. To support the rapid advancements of non-silicon MEMS it is necessary to introduce innovative techniques to process these MEMS packaging materials. In this study we present the application of pulsed laser ablation of ceramics, polymers and glass (MEMS packaging materials) to assist in fabrication of MEMS devices. Microstructuring of Al2O3 ceramic, polymers Poly-Vinyl-Alcohol (PVA), polystyrene (PS), and Pyrex glass were performed and studied by pulsed lasers at 193-nm, 266-nm and 308-nm wavelengths.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Vijay Kancharla, Kira Hendricks, and Shaochen Chen "Micromachining of packaging materials for MEMS using lasers", Proc. SPIE 4557, Micromachining and Microfabrication Process Technology VII, (28 September 2001); doi: 10.1117/12.442948; https://doi.org/10.1117/12.442948
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