2 October 2001 Characterization of MEMS mechanical properties using nanoscale techniques
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Proceedings Volume 4558, Reliability, Testing, and Characterization of MEMS/MOEMS; (2001) https://doi.org/10.1117/12.443015
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States
Abstract
This paper focuses on recent developments in the localised characterisation of the mechanical properties of Microsystems and MEMS devices and structures. Indentation techniques provide a highly powerful method for measuring the load and depth response of very small micro-machined silicon structures. Beam structures, such as are used for accelerometers, need to be characterised in terms of the number of cycles to failure, the spring constant or the energy required to bend the beam by a required amount. Such localised testing needs to be adapted to work at various distances from the origin of the beam with a positioning accuracy of less than a micron. Initial studies have proved to be highly repeatable. A range of examples is presented which cover a range of application areas, including accelerometer beam structures, microswitches and printer head structures. The basic instrumental concepts are explained together with the modifications required for testing small structures in a localised way.
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Nicholas X. Randall, Nicholas X. Randall, Richard A. J. Soden, Richard A. J. Soden, } "Characterization of MEMS mechanical properties using nanoscale techniques", Proc. SPIE 4558, Reliability, Testing, and Characterization of MEMS/MOEMS, (2 October 2001); doi: 10.1117/12.443015; https://doi.org/10.1117/12.443015
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