2 October 2001 Fracture toughness and fatigue investigations of polycrystalline silicon
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Proceedings Volume 4558, Reliability, Testing, and Characterization of MEMS/MOEMS; (2001) https://doi.org/10.1117/12.442998
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States
The fracture toughness of micromachined polycrystalline silicon samples, pre-cracked with an indenter or notched using a focused ion beam (FIB) machine, were tested using either bending or tensile loading. Fracture mechanics approaches were applied to determine the fracture toughness from these results. For the pre-cracked specimens tested by tensile loading, a fracture toughness value of KI,crit equals 0.86 MP(root)a derived. The FIB notched specimens had higher fracture toughness values, probably due to the influence of the notch tip radius and the FIB process. In addition, fatigue investigations of un-notched tensile specimens were performed using tensile cyclic loading with frequencies of 50, 200 and 1000 Hz. A reduction in the tensile strength from 1.10 GPa to 0.75 GPa after 108 cycles was detected while no influence of the test frequency on the fatigue behavior was observed.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Joerg Bagdahn, Joerg Bagdahn, Jan Schischka, Jan Schischka, Matthias Petzold, Matthias Petzold, William N. Sharpe, William N. Sharpe, "Fracture toughness and fatigue investigations of polycrystalline silicon", Proc. SPIE 4558, Reliability, Testing, and Characterization of MEMS/MOEMS, (2 October 2001); doi: 10.1117/12.442998; https://doi.org/10.1117/12.442998

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