2 October 2001 Optimization of anodic bonding to MEMS with self-assembled monolayer (SAM) coatings
Author Affiliations +
Proceedings Volume 4558, Reliability, Testing, and Characterization of MEMS/MOEMS; (2001) https://doi.org/10.1117/12.443007
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States
This work describes full wafer encapsulation of released, self-assembled monolayer (SAM) coated, multi-level polysilicon surface micromachines using the anodic bonding technique. This process has been utilized to protect fragile surface micromachines from damage due to particles, moisture contamination, and post-release die handling. The anodic bonding process was optimized to ensure strong glass-to-wafer bonds, while maintaining the effectiveness of liquid-phase and vapor-phase deposited SAM coatings. The temperature, time, and voltage effects on each SAM coating was analyzed. Glass-to-silicon and glass-to-SAM coated silicon had shear strengths of approximately 18 MPa. Glass-to-polysilicon bonds had lower shear strengths of approximately 10 MPa. Bonds were hermetic to 5 X 10-8 atm-cm3/s.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Melissa V. Collins, Melissa V. Collins, Lauren E. S. Rohwer, Lauren E. S. Rohwer, Andrew D. Oliver, Andrew D. Oliver, Matthew G. Hankins, Matthew G. Hankins, Deidre A. Hirschfeld, Deidre A. Hirschfeld, } "Optimization of anodic bonding to MEMS with self-assembled monolayer (SAM) coatings", Proc. SPIE 4558, Reliability, Testing, and Characterization of MEMS/MOEMS, (2 October 2001); doi: 10.1117/12.443007; https://doi.org/10.1117/12.443007


Advances in silicon-to-glass bonding with laser
Proceedings of SPIE (April 29 2001)
Silicon-glass anodic bonding at low temperature
Proceedings of SPIE (January 21 2005)
Adhesive wafer bonding for MEMS applications
Proceedings of SPIE (April 23 2003)

Back to Top