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2 October 2001 Physical and reliability issues in MEMS microrelays with gold contacts
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Proceedings Volume 4558, Reliability, Testing, and Characterization of MEMS/MOEMS; (2001) https://doi.org/10.1117/12.443006
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States
Abstract
This paper presents the work we have done on micro-relays with gold micro-contacts in MUMPs. Firstly, the theoretical physical principles of MEMS micro-relay are described. This study is divided in two parts: the micro-contact and the micro-actuator. The micro-contact part deals with resistance of constriction, contact area, adhesion, arcing and wear. Whereas the micro-actuator part describes general principles, contact force, restoring force and actuator reliability. Then, in a second part, an innovative electrostatic relay design in MUMPs is presented. The concept, the implementation and the final realization are discussed. Then, in the third part, characterization results are reported. This part particularly focuses on the micro-contact study. Conduction mode, contact area, mechanical and thermal deformation, and adhesion energies are presented.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xavier Lafontan, Francis Pressecq, Guy Perez, Christian Dufaza, and Jean Michel Karam "Physical and reliability issues in MEMS microrelays with gold contacts", Proc. SPIE 4558, Reliability, Testing, and Characterization of MEMS/MOEMS, (2 October 2001); https://doi.org/10.1117/12.443006
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