2 October 2001 Reliability of self-assembled 3D microstructures: dynamic snap-through modeling and experimental validation
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Proceedings Volume 4558, Reliability, Testing, and Characterization of MEMS/MOEMS; (2001) https://doi.org/10.1117/12.442991
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States
Abstract
The reliability study of advanced 3D self-assembled micro- machined polysilicon structures is investigated here with the aim of preventing the dynamic snap-through from occurring; snap-through is a vibratory phenomenon, which can lead to the destruction of a whole structure. 3D polysilicon micro-parts are self-assembled by beam buckling induced by the compressive force produced by Scratch Drive Actuator; this work considers the reliability of these micro-parts, and particularly the response of homogeneous, clamped- clamped polysilicon microfabricated buckled beams.
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Olivier Millet, Lionel Buchaillot, Emmanuel Quevy, Dominique Collard, "Reliability of self-assembled 3D microstructures: dynamic snap-through modeling and experimental validation", Proc. SPIE 4558, Reliability, Testing, and Characterization of MEMS/MOEMS, (2 October 2001); doi: 10.1117/12.442991; https://doi.org/10.1117/12.442991
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