Construction of a microfluidic bistable fluid amplifier using the nickel electroforming method

Narciso F. Macia

doi:10.1117/12.443068

28 September 2001 Construction of a microfluidic bistable fluid amplifier using the nickel electroforming method

Narciso F. Macia

Proceedings Volume 4560, Microfluidics and BioMEMS; (2001) https://doi.org/10.1117/12.443068
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States

Abstract

This paper presents a method for creating planar, fluidic devices by bonding together laminations created with the nickel electroforming method. The fluid amplifier is created by sandwiching together several, several .001 inch [25.4 microns] thick laminations. These laminations contain the fluid amplifier, vents and transfer channels. The laminations are initially coated with an adhesive, which acts as a bonding agent when subjected to heat. Special pins are used to insure proper alignment. The entire process is performed in a clean room environment to minimize problems. The proportional fluid amplifier is made bi-stable by introducing positive feedback.

Citation Download Citation

Narciso F. Macia "Construction of a microfluidic bistable fluid amplifier using the nickel electroforming method", Proc. SPIE 4560, Microfluidics and BioMEMS, (28 September 2001); https://doi.org/10.1117/12.443068

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