Component development and integration issues for MOEMS

James Castracane; Bai Xu; Yahong Yao; Christian Baks; Rein Lavrijsen

doi:10.1117/12.443087

2 October 2001 Component development and integration issues for MOEMS

James Castracane, Bai Xu, Yahong Yao, Christian Baks, Rein Lavrijsen

Proceedings Volume 4561, MOEMS and Miniaturized Systems II; (2001) https://doi.org/10.1117/12.443087
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States

Abstract

Following over a decade of MOEMS component development, attention in the research, development and commercial arenas has begun a significant shift to system-level integration of these structures. Applications abound in fields including optical communications, integrated sensors and bio/chemo diagnostics. Furthermore, the impending need for wafer- level integration of MOEMS with logic and actuation is driving R&D into developing a compatible process flow for ultimate, low-cost technology deployment. This paper will describe recent advances in MOEMS development and integration projects at the UAlbany Institute for Materials (UAIM). This discussion will focus on operational details of selected MOEMS projects including diffractive/reflective arrays, VCSEL arrays, and integrated sensor systems. These research and development details will be presented against a backdrop of the NanoFab 200 at UAIM, a unique 200 mm wafer prototyping and integration facility. In particular, reconfigurable diffractive and reflective arrays are currently under development in several complementary programs at UAIM. These programs encompass optical interconnect studies, active spectroscopy and metrology development. This paper will present the current status of these programs that are focused on optical performance improvements, process flow integration, packaging and lifetime tests. To complement these activities, selected MOEMS components are being integrated with VCSEL arrays for application to a variety of sensor systems. Development details of the VCSEL arrays and compatibility issues with custom MOEMS systems will be described. Finally, selected details of 200mm wafer-level integration studies will be presented to illustrate challenges and opportunities.

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James Castracane, Bai Xu, Yahong Yao, Christian Baks, and Rein Lavrijsen "Component development and integration issues for MOEMS", Proc. SPIE 4561, MOEMS and Miniaturized Systems II, (2 October 2001); https://doi.org/10.1117/12.443087

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KEYWORDS

Microopto electromechanical systems

Vertical cavity surface emitting lasers

Semiconducting wafers

Reflectivity

Optical testing

Prototyping

Sensors

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