Paper
11 March 2002 Characterization of an integrated multibeam laser mask-pattern generation and dry etch processing total solution
Alex H. Buxbaum, Melisa J. Buie, Brigitte C. Stoehr, Warren Montgomery, Scott E. Fuller
Author Affiliations +
Abstract
As mask specifications continually tighten with the ever- present progression of Moore's law, mask manufacturing specifications have become increasingly difficult to achieve. Global process optimization from coast to etch is critical for achieving the required mask performance. As an Applied Materials company, Etec is in a unique position within the maskmaking industry to introduce mask manufacturing solutions that are optimized across a number of process steps. Working with the Applied Materials photomask etch team, Etec's laser mask-patterning group characterized and implemented an integrated process recipe for the deep UV, raster-scan, continuous-wave, laser mask- patterning ALTA 4000 system and the Applied Materials Tetra Photomask Etch System.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alex H. Buxbaum, Melisa J. Buie, Brigitte C. Stoehr, Warren Montgomery, and Scott E. Fuller "Characterization of an integrated multibeam laser mask-pattern generation and dry etch processing total solution", Proc. SPIE 4562, 21st Annual BACUS Symposium on Photomask Technology, (11 March 2002); https://doi.org/10.1117/12.458309
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Cited by 1 scholarly publication.
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KEYWORDS
Etching

Photomasks

Photoresist processing

Plasma etching

Deep ultraviolet

Plasma

Thin film coatings

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