Improvement of alt-PSM production process using backside phase-measurement method

Hidetaka Saitou; Yasuhiro Koizumi; Syuichi Sanki; Tatsuhiko Kamibayashi; Shiaki M. Murai; Hiroyuki Miyashita; Hiroshi Fujita; Yasutaka Morikawa; Masami Nara; Naoya Hayashi; Morihisa Hoga

doi:10.1117/12.458273

11 March 2002 Improvement of alt-PSM production process using backside phase-measurement method

Hidetaka Saitou, Yasuhiro Koizumi, Syuichi Sanki, Tatsuhiko Kamibayashi, Shiaki M. Murai, Hiroyuki Miyashita, Hiroshi Fujita, Yasutaka Morikawa, Masami Nara, Naoya Hayashi, Morihisa Hoga

Author Affiliations +

Proceedings Volume 4562, 21st Annual BACUS Symposium on Photomask Technology; (2002) https://doi.org/10.1117/12.458273
Event: Photomask 2001, 2001, Monterey, CA, United States

Abstract

An alternating phase shift mask (Alt-PSM) enhances resolution and focus margin in wafer print. Therefore it comes into increasing use for device fabrication by KrF and ArF lithography. We have started production of alt-PSMs using quartz etched shifter and single trench structure, which are made by a two-step quartz etching process. This two-step quartz etching process has three writing steps; they are for chrome etching, quartz dry etching and quartz wet etching. We improved alt-PSM production process by using new backside phase measurement method. Consequently phase mean deviation from 180 degree was improved from +/- 2.0degree to +/- 1.5degree. And process steps reduced from 16 to 12 steps because twice alignment writing became once.

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Hidetaka Saitou, Yasuhiro Koizumi, Syuichi Sanki, Tatsuhiko Kamibayashi, Shiaki M. Murai, Hiroyuki Miyashita, Hiroshi Fujita, Yasutaka Morikawa, Masami Nara, Naoya Hayashi, and Morihisa Hoga "Improvement of alt-PSM production process using backside phase-measurement method", Proc. SPIE 4562, 21st Annual BACUS Symposium on Photomask Technology, (11 March 2002); https://doi.org/10.1117/12.458273

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