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11 March 2002 Improvement of alt-PSM production process using backside phase-measurement method
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Abstract
An alternating phase shift mask (Alt-PSM) enhances resolution and focus margin in wafer print. Therefore it comes into increasing use for device fabrication by KrF and ArF lithography. We have started production of alt-PSMs using quartz etched shifter and single trench structure, which are made by a two-step quartz etching process. This two-step quartz etching process has three writing steps; they are for chrome etching, quartz dry etching and quartz wet etching. We improved alt-PSM production process by using new backside phase measurement method. Consequently phase mean deviation from 180 degree was improved from +/- 2.0degree to +/- 1.5degree. And process steps reduced from 16 to 12 steps because twice alignment writing became once.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hidetaka Saitou, Yasuhiro Koizumi, Syuichi Sanki, Tatsuhiko Kamibayashi, Shiaki M. Murai, Hiroyuki Miyashita, Hiroshi Fujita, Yasutaka Morikawa, Masami Nara, Naoya Hayashi, and Morihisa Hoga "Improvement of alt-PSM production process using backside phase-measurement method", Proc. SPIE 4562, 21st Annual BACUS Symposium on Photomask Technology, (11 March 2002); https://doi.org/10.1117/12.458273
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