You have requested a machine translation of selected content from our databases. This functionality is provided solely for your convenience and is in no way intended to replace human translation. Neither SPIE nor the owners and publishers of the content make, and they explicitly disclaim, any express or implied representations or warranties of any kind, including, without limitation, representations and warranties as to the functionality of the translation feature or the accuracy or completeness of the translations.
Translations are not retained in our system. Your use of this feature and the translations is subject to all use restrictions contained in the Terms and Conditions of Use of the SPIE website.
11 March 2002New generation photomasks: 193-nm defect printability study
Today some IC manufacturers obtain finer circuit geometries by adding scatter bars (SB) to conventional binary masks as an efficient resolution enhancement technique (RET).1 These SB perform best when they are wide. However, to achieve better resolution and wider process windows modern stepper equipments feature lower wavelengths and higher numerical aperture lenses. These new steppers require narrower scatter bars to prevent them from printing on the wafer, and their effectiveness as a RET is diminishing as we follow the stepper technology 'roadmap'.
The alert did not successfully save. Please try again later.
Linard Karklin, Paul van Adrichem, Frank A.J.M. Driessen, Stan Mazor, "New generation photomasks: 193-nm defect printability study," Proc. SPIE 4562, 21st Annual BACUS Symposium on Photomask Technology, (11 March 2002); https://doi.org/10.1117/12.458315