4 October 2001 Development of PMP system for high-speed measurement of solder paste volume on printed circuit boards
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Proceedings Volume 4564, Optomechatronic Systems II; (2001) https://doi.org/10.1117/12.444095
Event: Intelligent Systems and Advanced Manufacturing, 2001, Boston, MA, United States
Non-contact measuring methodologies of 3D profile using CCD camera are very attractive because of their high measuring speed and high sensitivity. When projecting a grid pattern over the object, 3D information of the object can be extracted from the projected pattern image. Projection moire using a such a projected pattern image is used to extract 3D information with another grid pattern in front of CCD camera. As an alterative method to projection moire, phase measuring profilometry (PMP) without such an additional grid pattern is used to obtain similar but improved results under practical measurement environment. This paper describes a new PMP technique with improved practicality. In this technique, three or more snapshots over object undergoing dynamic motion with respect to camera are all that is required to capture the 3D surface contour of the object. This technique is principally similar to the existing PMP techniques using multiple phase shifting images and it provides a similar resolution. However, this enables the contouring speed to be increased up to the frame rate of the camera because it is not necessary for object or camera to be in static during snapshot. Furthermore, it also makes contouring at a reasonable resolution and accuracy possible because very highly intensive light sources like LED or halogen can be used for high contrast. The principle of the technique is described and some preliminary experimental results are presented. Experimental results demonstrated the feasbilitity of the technique for high-speed surface profile measurement.
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Kyung Min Jeong, Kyung Min Jeong, Jae-Seon Kim, Jae-Seon Kim, Kyoungchul Koh, Kyoungchul Koh, Hyungsuck Cho, Hyungsuck Cho, } "Development of PMP system for high-speed measurement of solder paste volume on printed circuit boards", Proc. SPIE 4564, Optomechatronic Systems II, (4 October 2001); doi: 10.1117/12.444095; https://doi.org/10.1117/12.444095

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