8 October 2001 Embedded electronics for a 64-channel wireless brain implant
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Proceedings Volume 4568, Microrobotics and Microassembly III; (2001) https://doi.org/10.1117/12.444119
Event: Intelligent Systems and Advanced Manufacturing, 2001, Boston, MA, United States
Abstract
The Telemetric Electrode Array System (TEAS) is a surgically implantable device for the study of neural activity in the brain. An 8x8 array of electrodes collects intra-cortical neural signals and connects them to an analog front end. The front end amplifies and digitizes these microvolt-level signals with 12 bits of resolution and at 31KHz per channel. Peak detection is used to extract the information carrying features of these signals, which are transmitted over a Bluetooth-based radio link at 725 Kbit/sec. The electrode array is made up of 1mm tall, 60-micron square electrodes spaced 500 microns tip-to-tip. A flex circuit connector provides mechanical isolation between the brain and the electronics, which are mounted to the cranium. Power consumption and management is a critical aspect of the design. The entire system must operate off a surgically implantable battery. With this power source, the system must provide the functionality of a wireless, 64-channel oscilloscope for several hours. The system also provides a low-power sleep mode during which the battery can be inductively charged. Power dissipation and biocompatibility issues also affect the design of the electronics for the probe. The electronics system must fit between the skull and the skin of the test subject. Thus, circuit miniaturization and microassembly techniques are essential to construct the probe's electronics.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Johann D. Burgert, Jan Malasek, Sylvain M. Martel, Colette Wiseman, Timothy Fofonoff, Robert Dyer, Ian Warwick Hunter, Nicholas Hatsopoulos, John Donoghue, "Embedded electronics for a 64-channel wireless brain implant", Proc. SPIE 4568, Microrobotics and Microassembly III, (8 October 2001); doi: 10.1117/12.444119; https://doi.org/10.1117/12.444119
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