21 November 2001 Interfacing requirements for MEMS components in system-on-chip methodologies
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Modern VLSI design is moving towards a System-on-Chip design paradigm, where chip design involves the integration of separate macrocells from different manufacturers. This paper explores the obstacles to adopting this same methodology for systems incorporating MEMS components. These obstacles include the technology specific nature of most MEMS devices, interference between MEMS sensors, and the limited electronics device density of mixed MEMS/Microelectronics technologies. It is conjectured that one fruitful avenue for further work is the development of MEMS interface circuits which can be incorporated into a single SoC along with other electronics macrocells, and which then connect to discrete MEMS sensor chips.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Neil W. Bergmann, Neil W. Bergmann, "Interfacing requirements for MEMS components in system-on-chip methodologies", Proc. SPIE 4591, Electronics and Structures for MEMS II, (21 November 2001); doi: 10.1117/12.449173; https://doi.org/10.1117/12.449173


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