21 November 2001 Processing compatibility of ZnO piezoelectric film with MEMS device
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Abstract
This paper presents the processing compatibility of ZnO piezoelectric film with MEMS devices. ZnO film has widely been used as an important element in the field of MEMS due to its good piezoelectric performance. The present investigations mainly focus on fabricating the ZnO film with good performance by optimizing the fabrication process. However, through our experiments, we found that further micromachining processes can badly modify the performance of ZnO film if they haven't been considered properly. Thus, different from other studies, this paper discusses techniques to keep the good piezoelectric performance of ZnO film in further processes after the ZnO film has been formed. These further processes for the device with ZnO film mostly include photolithography, wet and dry etching, stripping, cleaning, and depositing. The paper will present how these further processes change the performance of ZnO film and how to decrease or avoid the change of the performance, especially when the high temperature processes is needed. Some suggestion about process was given.
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Tao Xu, Tao Xu, Guoying Wu, Guoying Wu, Guobing Zhang, Guobing Zhang, Yilong Hao, Yilong Hao, } "Processing compatibility of ZnO piezoelectric film with MEMS device", Proc. SPIE 4592, Device and Process Technologies for MEMS and Microelectronics II, (21 November 2001); doi: 10.1117/12.448990; https://doi.org/10.1117/12.448990
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