Characterization of electronic packaging materials and components by image correlation methods

Dietmar Vogel; Juergen Auersperg; Bernd Michel

doi:10.1117/12.447348

30 October 2001 Characterization of electronic packaging materials and components by image correlation methods

Dietmar Vogel, Juergen Auersperg, Bernd Michel

Proceedings Volume 4596, Advanced Photonic Sensors and Applications II; (2001) https://doi.org/10.1117/12.447348
Event: International Symposium on Photonics and Applications, 2001, Singapore, Singapore

Abstract

Recent advances in micro electronics and electronic packaging have led to a strong need in material characterization on micro and nano scale. The authors present an approach to deformation measurement based on localized correlation analysis on load state images. Displacement and strain fields are extracted from images, captured by high resolution equipment, e.g. by optical far distance, scanning electron and scanning force microscopes. As a result object response to mechanical or thermal load can be recorded from microscopic or nanoscopic material areas. Within the paper a brief overview is given about measurement basics, achievable measurement resolution and equipment. The method is being applied to thermo-mechanical reliability studies on electronic packaging components. As an example stress suppression mechanisms on advanced chip scale packages (CSP) have been investigated. Spatially resolved deformation measurement by correlation techniques could have been extended successfully to AFM imaging. A corresponding application is demonstrated for experiments on microcrack evaluation. In order to measure material properties a modified correlation algorithm is applied assuming homogeneous material response. Determining average strains over micrographs material properties as coefficients of thermal expansion (CTE) and Poisson ratios can be determined on micro objects.

Citation Download Citation

Dietmar Vogel, Juergen Auersperg, and Bernd Michel "Characterization of electronic packaging materials and components by image correlation methods", Proc. SPIE 4596, Advanced Photonic Sensors and Applications II, (30 October 2001); https://doi.org/10.1117/12.447348

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available