15 October 2001 Design, simulation, and evaluation of novel corrugated diaphragms based on backside sacrificial layer etching technique
Author Affiliations +
Proceedings Volume 4601, Micromachining and Microfabrication Process Technology and Devices; (2001) https://doi.org/10.1117/12.444736
Event: International Symposium on Optoelectonics and Microelectronics, 2001, Nanjing, China
Abstract
A novel single-chip condenser structure consists of a corrugated diaphragm and a backplate is presented using the backside sacrificial layer etching technique. Several kinds of corrugated diaphragms achieved by the anisotropic etch with KOH solution and Inductively Coupled Plasma (ICP) etch have been designed and simulated. An electrostatic-structural coupling FEM analysis was performed using the commercial FEA software ANSYS. The influence of various nonlinear effects on the performance of diaphragms are studied and all the corrugated diaphragms show a sensitivity more than one order larger than that of the flat diaphragm of equal size and thickness. The optimum balance between performance and stability is found.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jing Chen, Jing Chen, Li-Tian Liu, Li-Tian Liu, Zhijian Li, Zhijian Li, } "Design, simulation, and evaluation of novel corrugated diaphragms based on backside sacrificial layer etching technique", Proc. SPIE 4601, Micromachining and Microfabrication Process Technology and Devices, (15 October 2001); doi: 10.1117/12.444736; https://doi.org/10.1117/12.444736
PROCEEDINGS
5 PAGES


SHARE
Back to Top