15 October 2001 Electrochemical studies of electrodeposition of nickel for LIGA microstructures
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Proceedings Volume 4601, Micromachining and Microfabrication Process Technology and Devices; (2001) https://doi.org/10.1117/12.444706
Event: International Symposium on Optoelectonics and Microelectronics, 2001, Nanjing, China
Abstract
The comparison of Nickel electrodeposition in LIGA process with traditional electroplating by electrochemical methods was reported. The mass transport limitation during microelectroforming in LIGA was studied by linear potential sweep technique, the limiting current is easier to reach for plating into LIGA molds. The A.C. impedance measurement also supports the above viewpoint, beside this, it seems that the mechanism of electrode reaction also differ from that of conventional nickel plating. A semi-automatic electroforming equipment for LIGA process has been developed, various nickel microstructures with high aspect ratios have been fabricated in this equipment. a series of micro nickel gears have been fabricated, an advanced micro gear-box with 2mm diameter has been assembled, it works very well.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Guifu Ding, Guifu Ding, Yi Zhang, Yi Zhang, Jingquan Liu, Jingquan Liu, Xiaolin Zhao, Xiaolin Zhao, Bingchu Cai, Bingchu Cai, Tianhui Shen, Tianhui Shen, } "Electrochemical studies of electrodeposition of nickel for LIGA microstructures", Proc. SPIE 4601, Micromachining and Microfabrication Process Technology and Devices, (15 October 2001); doi: 10.1117/12.444706; https://doi.org/10.1117/12.444706
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